Copper plating is a critical solution for industries that need durability, appearance and function. Galtek plates copper to MIL-C-14550, ASTM B734 and AMS 2418, using rack, barrel and project-specific methods for small batches and series production.
- Can be used as an underlayer for nickel or tin, or as the final coating
- Compliant with MIL-C-14550, AMS 2418 and ASTM B734
- Flexible solutions for small batches and series production
Applications
- Electronics and telecom
- Printed circuit boards, semiconductors and cables.
- Aerospace and automotive
- Corrosion resistance and heat transfer on engine parts and fasteners.
- Decorative
- Jewellery, furniture and kitchenware.
Advantages
- High electrical and thermal conductivity; eases soldering
- Corrosion protection as an underlayer
- Ductility and excellent adhesion
- Bright, smooth decorative finishes
- Naturally antibacterial
- Masking and protection before carburising and nitriding
Substrates we plate
- Ferrous
- Carbon steel, stainless steel, hardened steel, tool steels
- Copper-based
- Pure copper, copper alloys (tellurium and beryllium), brass, nickel-silver alloys
- Aluminium-based
- Wrought aluminium, cast aluminium, special alloys (MIC-6)
- Other
- Inconel, pure nickel (Nickel 200), cobalt-chrome (MP35N), Kovar and Monel, Hastelloy, lead
Copper plating standards
MIL-C-14550
US military standard; adhesion, test procedures and minimum thickness.
- Class 0: 25–127 µm (heat-treat stop-off) · Class 1: 25 µm (carburising, circuit boards)
- Class 2: 12.7 µm (underlayer for nickel and others) · Class 3: 5 µm (prevents migration under tin)
ASTM B734
Engineering copper plating.
- Class 25 / 20 / 12 / 5: min. 25 / 20 / 12 / 5 µm
AMS 2418
Aerospace standard. Type 1: 12.7–17.8 µm (engineering) · Type 2: 50.8 µm (masking).